1. 2. 3. material content data sheet sales product name ifx7805abtf issued 29. august 2013 ma# MA000992662 package pg-to252-3-11 weight* 398.57 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.237 0.31 0.31 3104 3104 leadframe non noble metal iron 7439-89-6 0.140 0.04 351 inorganic material phosphorus 7723-14-0 0.042 0.01 105 non noble metal copper 7440-50-8 139.706 35.05 35.10 350517 350973 wire non noble metal aluminium 7429-90-5 0.143 0.04 0.04 360 360 encapsulation organic material carbon black 1333-86-4 0.315 0.08 789 plastics epoxy resin - 14.469 3.63 36302 inorganic material silicondioxide 60676-86-0 142.487 35.74 39.45 357495 394586 leadfinish non noble metal tin 7440-31-5 3.740 0.94 0.94 9384 9384 plating non noble metal nickel 7440-02-0 0.091 0.02 228 inorganic material phosphorus 7723-14-0 0.000 0.00 0.02 1 229 solder noble metal silver 7440-22-4 0.040 0.01 100 non noble metal tin 7440-31-5 0.032 0.01 80 non noble metal lead 7439-92-1 1.517 0.38 0.40 3807 3987 heatspreader non noble metal iron 7439-89-6 0.095 0.02 237 inorganic material phosphorus 7723-14-0 0.028 0.01 71 non noble metal copper 7440-50-8 94.488 23.71 23.74 237069 237377 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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